Solutions

Polybar®-Blister and Push-through lid foil

The Polybar® range of thermoformin blister materials are based on two core materials. Polybar®-COC structers have a core of COC (Cylic Olefin Copolymer) between two layers of Polypropylene. These are free from halogens and provide a medium to high moisture vapour barrier in the range 0.2 – 0.6 g/m2/day. The COC outer layer can be alternate materials to best suit the need of the product.

Polybar®-Aclar® is typically laminated to PVC film to 191 µm (7.5mil) or 254 µm (10mil) or other substrates like APET for non PVC applications. The Aclar® (PTCFE) film has an excellent moisture vapour barrier in the range 0.05 – 0.2 g/m2/d.

Lidding foil for Polybar® products includes standard PVC/PVDC sealable push-through foil for Aclar®, PP-sealable foils for Polybar®-COC and Aclar®-sealable foil for Aclar®. Aclar®-In lid will provide a good seal to the outer flange of the blister. With Aclar® material towards the inside of the blister cavity, side moisture ingress is slowed down because the lidstock is in direct contact with the Aclar®. This may be suitable for products requiring chemical protection or for special drug delivery systems. Other lid foils, such as peel or peel-push laminates are available.

Alcan Packaging Polybar® products and technical support are offered globally. 

Click on the following links to download product data sheets for Polybar®-COC (US - Europe English) and Polybar®-Alcar® (US - Europe English)

Packaging Design: Theoretical Barrier

TherSis™: Thermoforming Simulation

TherSis™ is Amcor thermoforming simulation for high-barrier polymer films for pharmaceutical packaging. Parameters are used to model a package to predict barrier. The simulation is coupled with dynamic thermo-mechanical analysis.

TherSis™ provides a prediction of film thickness distribution based on the influence of tool geometry and process parameters, including whether plug-assist is used. The output of the calculations provide barrier properties (water vapour barrier/oxygen transmission rate) for pre-screening prior to stability put-ups.

Thersis™ simulation helps to achieve the best process parameters for the lowest permeation values for our Amcor film portfolio.

With more novel new drug delivery systems, and customers demanding more performance from packaging materials, the challenge is finding which high barrier material is best suited for the application.

After Formpack®, with total barrier properties, the thermoformed blisters need to achieve the lowest permeation values possible, while not compromising product integrity or stability results.

To achieve the lowest permeation levels for plastic films, it is necessary to thermoform as close to a constant wall thickness and uniform cavity distribution as is possible.

TherSis™ predicts blister properties prior to production

 

This enables:

• Choice of blister film to meet barrier demands
• Optimization of process data
• Optimization of blister geometry
• Improve likelihood of positive stability outcomes

Aclar® (www.aclar.com) is a registered trademark of Honeywell.